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MICRO
2006
IEEE
144views Hardware» more  MICRO 2006»
14 years 1 months ago
Die Stacking (3D) Microarchitecture
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
ICMCS
2005
IEEE
75views Multimedia» more  ICMCS 2005»
14 years 1 months ago
Optimizing Prefetch in a Residential Gateway with Networked Storage Systems
VOD services require the storage system support with multiple disks. SCSI-based systems are usual choices. However, disks can be attached directly to networks these days. Fiber Ch...
Eunsam Kim, Jonathan C. L. Liu
SC
1991
ACM
13 years 11 months ago
Delayed consistency and its effects on the miss rate of parallel programs
In cache based multiprocessors a protocol must maintain coherence among replicated copies of shared writable data. In delayed consistency protocols the effect of out-going and in-...
Michel Dubois, Jin-Chin Wang, Luiz André Ba...
USENIX
2007
13 years 10 months ago
Evaluating Block-level Optimization Through the IO Path
This paper focuses on evaluation of the effectiveness of optimization at various layers of the IO path, such as the file system, the device driver scheduler, and the disk drive i...
Alma Riska, James Larkby-Lahet, Erik Riedel
ICALP
2010
Springer
13 years 9 months ago
Resource Oblivious Sorting on Multicores
We present a new deterministic sorting algorithm that interleaves the partitioning of a sample sort with merging. Sequentially, it sorts n elements in O(n log n) time cache-oblivi...
Richard Cole, Vijaya Ramachandran