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3DIC
2009
IEEE
153views Hardware» more  3DIC 2009»
14 years 5 months ago
Junction-level thermal extraction and simulation of 3DICs
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...
ACSAC
2009
IEEE
14 years 5 months ago
Privacy through Noise: A Design Space for Private Identification
To protect privacy in large systems, users must be able to authenticate against a central server without disclosing their identity to the network. Private identification protocols ...
Karsten Nohl, David Evans
AINA
2009
IEEE
14 years 5 months ago
Multi-node Processing for Asymmetrical Communications in Underwater Acoustic Networks
— Underwater acoustic communication networks have attracted attention for its applications in many areas such as mine warfare, rapid environmental assessment or search and rescue...
Antonio Silva, Julien Huillery, Sergio M. Jesus
ARTCOM
2009
IEEE
14 years 5 months ago
Chunker for Tamil
This paper presents the Part Of Speech tagger and Chunker for Tamil using Machine learning techniques. Part Of Speech tagging and chunking are the fundamental processing steps for...
V. Dhanalakshmi, P. Padmavathy, M. Anand Kumar, K....
ASUNAM
2009
IEEE
14 years 5 months ago
Harnessing Wisdom of the Crowds Dynamics for Time-Dependent Reputation and Ranking
—The “wisdom of the crowds” is a concept used to describe the utility of harnessing group behaviour, where user opinion evolves over time and the opinion of the masses collec...
Elizabeth M. Daly