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ITC
2003
IEEE
172views Hardware» more  ITC 2003»
14 years 2 months ago
First IC Validation of IEEE Std. 1149.6
–This paper provides proof of concept for the newly-approved 1149.6 standard by investigating the first silicon implementation of the test receiver. EXTEST and EXTEST_PULSE tests...
Suzette Vandivier, Mark Wahl, Jeff Rearick
IOLTS
2003
IEEE
124views Hardware» more  IOLTS 2003»
14 years 2 months ago
The positive effect on IC yield of embedded Fault Tolerance for SEUs
Fault tolerant design is a technique emerging in Integrated Circuits (IC’s) to deal with the increasing error susceptibility (Soft Errors, or Single Event Upsets, SEU) caused by...
André K. Nieuwland, Richard P. Kleihorst
ISQED
2003
IEEE
96views Hardware» more  ISQED 2003»
14 years 2 months ago
New DFM Approach Abstracts AltPSM Lithography Requirements for sub-100nm IC Design Domains
Approach Abstracts AltPSM Lithography Requirements for sub-100nm IC Design Domains Pradiptya Ghosh, Chung-shin Kang, Michael Sanie and David Pinto Numerical Technologies, 70 West P...
Pradiptya Ghosh, Chung-shin Kang, Michael Sanie, D...
ISQED
2003
IEEE
123views Hardware» more  ISQED 2003»
14 years 2 months ago
Advanced Module Packaging Method
An intermediate solution between conventional printed circuit board technology and wafer level packaging, WLP, is to fabricate interconnection circuits and flip chip assembly stru...
Peter C. Salmon
ITC
2003
IEEE
127views Hardware» more  ITC 2003»
14 years 2 months ago
Architecting Millisecond Test Solutions for Wireless Phone RFIC's
Today’s low cost wireless phones have driven a need to be able to economically test high volumes of complex RF IC’s at a fraction of the cost of the IC. In June of 2001 the IB...
John Ferrario, Randy Wolf, Steve Moss