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ESWA
2007
13 years 7 months ago
2007
Packaging is classified as one of back-end processes in the integrated circuits (ICs) manufacturing, highly capital-intensive and involves complex processes. Unlike the front-end...
ENGL
2007
13 years 7 months ago
2007
—A 2.5V high precision BiCMOS bandgap reference with supply voltage range of 6V to 18V was proposed and realized. It could be applied to lots of Power Management ICs (Intergrated...
CASCON
2004
13 years 9 months ago
2004
For several reasons a database may not satisfy certain integrity constraints (ICs), for example, when it is the result of integrating several independent data sources. However, mo...
DAC
2007
ACM
14 years 8 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
ISCAS
2007
IEEE
14 years 1 months ago
2007
IEEE
—This paper investigates the suitability of 90nm and 65nm GP and LP CMOS technology for SOC applications in the 60GHz to 100GHz range. Examples of system architectures and transc...