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22

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ASPDAC
2007
ACM

95views Hardware» more ASPDAC 2007»

Meeting with the Forthcoming IC Design "The Era of Power, Variability and NRE Explosion and a Bit of the Future"

13 years 11 months ago

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Takayasu Sakurai

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22

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MVA
2000

152views Computer Vision» more MVA 2000»

Automatic IC orientation checks

13 years 7 months ago

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With the proliferation of different types of IC packages, there is a need for machine-vision-based inspection systems to be able to efficiently identify the orientation of IC packa...

Ashraf A. Kassim, H. Zhou, S. Ranganath

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12

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MVA
2007

146views Computer Vision» more MVA 2007»

A SVM Based Method to Detect Color Shift Defects in IC Packages

13 years 9 months ago

Download b2.cvl.iis.u-tokyo.ac.jp

Automated Visual Inspection (AVI) is an essential part in the manufacturing process of Integrated Circuit (IC) packages. Contamination a common defect type found in IC packages ap...

R. M. C. B. Ratnayake, Craig Hicks, M. A. Akbari

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16

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MVA
1998

108views Computer Vision» more MVA 1998»

Fast Search Algorithms for IC Printed Mark Quality Inspection

13 years 9 months ago