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TCAD
2008
13 years 7 months ago
2008
Abstract--The electrostatic discharge (ESD) problem has become a challenging reliability issue in nanometer-circuit design. High voltages that resulted from ESD might cause high cu...
JETC
2008
13 years 6 months ago
2008
With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a severe issue in to...
FUIN
2008
13 years 7 months ago
2008
The aim of this work is to describe the translation from Intermediate Language, one of the input formalisms of the model checking platform VerICS, to timed automata with discrete d...
ASPDAC
2008
ACM
13 years 9 months ago
2008
ACM
The capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns ...
ICCD
2008
IEEE
14 years 4 months ago
2008
IEEE
— Test-access mechanisms (TAMs) and test wrappers (e.g., the IEEE Standard 1500 wrapper) facilitate the modular testing of embedded cores in a core-based system-on-chip (SOC). Su...