Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Computational protein design can be formulated as an optimization problem, where the objective is to identify the sequence of amino acids that minimizes the energy of a given prot...
Noah Ollikainen, Ellen Sentovich, Carlos Coelho, A...
With the adoption of ultra regular fabric paradigms for controlling design printability at the 22nm node and beyond, there is an emerging need for a layout-driven, pattern-based p...
Tarek A. El-Moselhy, Ibrahim M. Elfadel, Luca Dani...
As VLSI technology reaches 45nm technology node, leakage power optimization has become a major design challenge. Threshold voltage (vt) assignment has been extensively studied, du...
Boolean satisfiability (SAT) based methods have traditionally been popular for formally verifying properties for digital circuits. We present a novel methodology for formulating a...
Saurabh K. Tiwary, Anubhav Gupta, Joel R. Phillips...