Sciweavers

52 search results - page 9 / 11
» iccd 2005
Sort
View
ICCD
2005
IEEE
131views Hardware» more  ICCD 2005»
14 years 7 months ago
A Flexible Design Methodology for Analog Test Wrappers in Mixed-Signal SOCs
The manufacturing test cost for mixed-signal SOCs is widely recognized to be much higher than that for digital SOCs. It has been shown in recent prior work that the use of analog ...
Anuja Sehgal, Sule Ozev, Krishnendu Chakrabarty
ICCD
2005
IEEE
98views Hardware» more  ICCD 2005»
14 years 7 months ago
Reducing the Latency and Area Cost of Core Swapping through Shared Helper Engines
Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature managem...
Anahita Shayesteh, Eren Kursun, Timothy Sherwood, ...
ICCD
2005
IEEE
109views Hardware» more  ICCD 2005»
14 years 7 months ago
VALVE: Variable Length Value Encoder for Off-Chip Data Buses.
We propose VAriable Length Value Encoding (VALVE) technique to reduce the power consumption in the off-chip data buses. While past research has focused on encoding fixed length da...
Dinesh C. Suresh, Banit Agrawal, Walid A. Najjar, ...
ICCD
2005
IEEE
101views Hardware» more  ICCD 2005»
14 years 7 months ago
Three-Dimensional Cache Design Exploration Using 3DCacti
As technology scales, interconnects dominate the performance and power behavior of deep submicron designs. Three-dimensional integrated circuits (3D ICs) have been proposed as a w...
Yuh-Fang Tsai, Yuan Xie, Narayanan Vijaykrishnan, ...
ICCD
2005
IEEE
102views Hardware» more  ICCD 2005»
14 years 7 months ago
Monitoring Temperature in FPGA based SoCs
FPGA logic densities continue to increase at a tremendous rate. This has had the undesired consequence of increased power density, which manifests itself as higher ondie temperatu...
Sivakumar Velusamy, Wei Huang, John Lach, Mircea R...