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ICCAD
2009
IEEE
13 years 8 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
DAC
2009
ACM
14 years 11 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
ICCAD
2009
IEEE
13 years 8 months ago
2009
IEEE
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
IUI
2009
ACM
14 years 7 months ago
2009
ACM
We all encounter many documents on a daily basis that we do not have time to process in their entirety. Nevertheless, we lack good tools to rapidly skim and identify key informati...
SEMWEB
2009
Springer
14 years 5 months ago
2009
Springer
In many data-centric applications, it is desirable to use OWL as an expressive schema language with which one expresses constraints that must be satisfied by instance data. Howeve...