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MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
SKG
2006
IEEE
14 years 3 months ago
2006
IEEE
With the rapid evolution of web technology and Internet, the mathematical web has emerged as a new research trend, which changes the traditional manner of mathematical scientific ...
CASES
2006
ACM
14 years 3 months ago
2006
ACM
Designers of SoCs with non-digital components, such as analog or MEMS devices, can currently use high-level system design languages, such as SystemC, to model only the digital par...
SBCCI
2006
ACM
14 years 3 months ago
2006
ACM
Platform-based design is a method to implement complex SoCs, avoiding chip design from scratch. A promising evolution of platform-based design are MPSoC. Such generic architecture...
SIGECOM
2006
ACM
14 years 3 months ago
2006
ACM
We consider a multicast game with selfish non-cooperative players. There is a special source node and each player is interested in connecting to the source by making a routing de...