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2007
IEEE
15 years 10 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
COLCOM
2007
IEEE
15 years 10 months ago
Cooperative security in distributed sensor networks
— Distributed sensor network protocols, such as routing, time synchronization or data aggregation protocols make use of collaborative techniques to minimize the consumption of sc...
Oscar García Morchon, Heribert Baldus, Tobi...
COLCOM
2007
IEEE
15 years 10 months ago
Peer2Schedule - an experimental peer-to-peer application to support present collaboration
Abstract—This paper describes experiences from implementing an experimental mobile peer-to-peer application called Peer2Schedule aimed at improving and supporting collaboration w...
Alf Inge Wang, Peter Nicolai Motzfeldt
CSFW
2007
IEEE
15 years 10 months ago
Creating Vulnerability Signatures Using Weakest Preconditions
Signature-based tools such as network intrusion detection systems are widely used to protect critical systems. Automatic signature generation techniques are needed to enable these...
David Brumley, Hao Wang, Somesh Jha, Dawn Xiaodong...
CVPR
2007
IEEE
15 years 10 months ago
Shape Variation-Based Frieze Pattern for Robust Gait Recognition
Gait is an attractive biometric for vision-based human identification. Previous work on existing public data sets has shown that shape cues yield improved recognition rates compar...
Seungkyu Lee, Yanxi Liu, Robert T. Collins
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