TCAD
2010
13 years 1 months ago
2010
Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient netwo...
ICPP
2007
IEEE
14 years 1 months ago
2007
IEEE
Three-dimensional Network-on-Chip (3-D NoC) is an emerging research topic exploring the network architecture of 3-D ICs that stack several smaller wafers for reducing wire length ...
NOCS
2009
IEEE
14 years 1 months ago
2009
IEEE
Design Constraints imposed by global interconnect delays as well as limitations in integration of disparate technologies make 3-D chip stacks an enticing technology solution for m...