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    DAC
    2011
    ACM
    147views Computer Architecture» more  DAC 2011»
    Non-uniform micro-channel design for stacked 3D-ICs
    13 years 7 days ago
    Non-uniform micro-channel design for stacked 3D-ICs
    Download  ftp.eng.umd.edu
    Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
    Bing Shi, Ankur Srivastava, Peng Wang
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