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ASPDAC
2011
ACM
207views Hardware» more  ASPDAC 2011»
13 years 3 months ago
Vertical interconnects squeezing in symmetric 3D mesh Network-on-Chip
Abstract— Three-dimensional (3D) integration and Networkon-Chip (NoC) are both proposed to tackle the on-chip interconnect scaling problems, and extensive research efforts have b...
Cheng Liu, Lei Zhang 0008, Yinhe Han, Xiaowei Li