—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
A new asynchronous interconnection network is introduced for globally-asynchronous locally-synchronous (GALS) chip multiprocessors. The network eliminates the need for global cloc...
Michael N. Horak, Steven M. Nowick, Matthew Carlbe...