AINA
2008
IEEE
14 years 3 months ago
2008
IEEE
This paper describes an architecture for sharing data in XML format through a peer-to-peer (P2P) network, which interconnects devices ranging from high-end servers to mobile devic...
AINA
2008
IEEE
14 years 3 months ago
2008
IEEE
—This work tries to derive ideas for thread allocation in Chip Multiprocessor (CMP)-based network processors performing general applications by Continuous-Time Markov Chain model...
AINA
2008
IEEE
14 years 3 months ago
2008
IEEE
—In the paper, we study the wavelength assignment problem in waveband switching (WBS) networks, which is composed of multi-granular optical cross-connect (MG-OXCs) interconnected...
AINA
2008
IEEE
14 years 3 months ago
2008
IEEE
AINA
2008
IEEE
14 years 3 months ago
2008
IEEE
The Home Network is a pervasive environment by nature. Its openness to dynamic distributed and heterogeneous devices brings great challenges in home application design. We present...
AINA
2008
IEEE
14 years 3 months ago
2008
IEEE
In content-based communication, information flows towards interested hosts rather than towards specifically set destinations. This new style of communication perfectly fits the...
AINA
2008
IEEE
14 years 3 months ago
2008
IEEE
—In a broadcasting task, source node wants to send the same message to all the other nodes in the network. Existing solutions range from connected dominating set (CDS) based for ...
AINA
2008
IEEE
14 years 3 months ago
2008
IEEE
The paper introduces a peer-to-peer system called P2PRIV (peer-to-peer direct and anonymous distribution overlay). Basic novel features of P2PRIV are: (i) a peer-to-peer parallel ...
AINA
2008
IEEE
14 years 3 months ago
2008
IEEE
Virtualization is a common strategy for improving the utilization of existing computing resources, particularly within data centers. However, its use for high performance computin...
SLIP
2009
ACM
14 years 3 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...