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ICCD
2007
IEEE
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ICCD 2007
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Analytical thermal placement for VLSI lifetime improvement and minimum performance variation
14 years 8 months ago
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vlsicad.ucsd.edu
DSM and nanometer VLSI designs are subject to an increasingly significant thermal effect on VLSI circuit lifetime and performance variation, which can be effectively subdued by V...
Andrew B. Kahng, Sung-Mo Kang, Wei Li, Bao Liu
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