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21
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MR
2006
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Robotics
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MR 2006
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A reliability-driven placement procedure based on thermal-force model
13 years 8 months ago
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ir.lib.stut.edu.tw
This paper deals with placing chips on an MCM substrate in chip array style for minimizing the system failure rate. The placement procedure begins with constructing an initial pla...
Jing Lee
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