A reliability-driven placement procedure based on thermal-force model

This paper deals with placing chips on an MCM substrate in chip array style for minimizing the system failure rate. The placement procedure begins with constructing an initial placement based on cooling considerations. Then, a thermal-force model is presented to transform the reliability-driven placement problem to solve a set of simultaneous nonlinear equations to determine thermal-force-equilibrium locations of the chips. A modified Newton

• Type: Journal
• Year: 2006
• Where: MR
• Authors: Jing Lee
• Keywords: Array Style, Chip, Chip Array Style, MR 2006, Robotics