ASPDAC
2012
ACM
12 years 7 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
ASPDAC
2012
ACM
12 years 7 months ago
2012
ACM
—Host-compiled simulation has been widely adopted as a practical approach for fast and high-level evaluation of complex software-intensive systems at early stages of the design p...