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3DIC
2009
IEEE
178views Hardware» more  3DIC 2009»
14 years 2 months ago
Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs
This paper presents an analysis and comparison between synchronous and delay-insensitive asynchronous logic circuits on thermal distributions for investigating novel solutions to t...
Brent Hollosi, Tao Zhang, Ravi Sankar Parameswaran...
GLVLSI
2006
IEEE
115views VLSI» more  GLVLSI 2006»
14 years 5 months ago
Yield enhancement of asynchronous logic circuits through 3-dimensional integration technology
This paper presents a systematic design methodology for yield enhancement of asynchronous logic circuits using 3-D (3-Dimensional) integration technology. In this design, the targ...
Song Peng, Rajit Manohar