TCAD
2011
13 years 9 months ago
2011
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
ICCAD
2009
IEEE
14 years 19 days ago
2009
IEEE
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
ASPDAC
2005
ACM
14 years 4 months ago
2005
ACM
As the minimum feature sizes of VLSI circuits get smaller while the clock frequency increases, the effects of process variations become significant. We propose a UST/DME based ap...