Sciweavers

DAC
2009
ACM
15 years 16 days ago
SRAM parametric failure analysis
With aggressive technology scaling, SRAM design has been seriously challenged by the difficulties in analyzing rare failure events. In this paper we propose to create statistical ...
Jian Wang, Soner Yaldiz, Xin Li, Lawrence T. Pileg...
DAC
2009
ACM
15 years 16 days ago
Improving testability and soft-error resilience through retiming
State elements are increasingly vulnerable to soft errors due to their decreasing size, and the fact that latched errors cannot be completely eliminated by electrical or timing ma...
Smita Krishnaswamy, Igor L. Markov, John P. Hayes
DAC
2009
ACM
15 years 16 days ago
Statistical reliability analysis under process variation and aging effects
Circuit reliability is affected by various fabrication-time and run-time effects. Fabrication-induced process variation has significant impact on circuit performance and reliabilit...
Yinghai Lu, Li Shang, Hai Zhou, Hengliang Zhu, Fan...
DAC
2009
ACM
15 years 16 days ago
Provably good and practically efficient algorithms for CMP dummy fill
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
Chunyang Feng, Hai Zhou, Changhao Yan, Jun Tao, Xu...
DAC
2009
ACM
15 years 16 days ago
Event-driven gate-level simulation with GP-GPUs
Logic simulation is a critical component of the design tool flow in modern hardware development efforts. It is used widely ? from high-level descriptions down to gate-level ones ?...
Debapriya Chatterjee, Andrew DeOrio, Valeria Berta...
DAC
2009
ACM
15 years 16 days ago
Efficient SAT solving for non-clausal formulas using DPLL, graphs, and watched cuts
Boolean satisfiability (SAT) solvers are used heavily in hardware and software verification tools for checking satisfiability of Boolean formulas. Most state-of-the-art SAT solver...
Himanshu Jain, Edmund M. Clarke
DAC
2009
ACM
15 years 16 days ago
Exploring serial vertical interconnects for 3D ICs
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
Sudeep Pasricha
DAC
2009
ACM
15 years 16 days ago
Thermal-driven analog placement considering device matching
With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the ther...
Po-Hung Lin, Hongbo Zhang, Martin D. F. Wong, Yao-...
DAC
2009
ACM
15 years 16 days ago
Contract-based system-level composition of analog circuits
Efficient system-level design is increasingly relying on hierarchical design-space exploration, as well as compositional methods, to shorten time-to-market, leverage design re-use...
Xuening Sun, Pierluigi Nuzzo, Chang-Ching Wu, Albe...