Sciweavers
Explore
Publications
Books
Software
Tutorials
Presentations
Lectures Notes
Datasets
Labs
Conferences
Community
Upcoming
Conferences
Top Ranked Papers
Most Viewed Conferences
Conferences by Acronym
Conferences by Subject
Conferences by Year
Tools
Sci2ools
International Keyboard
Graphical Social Symbols
CSS3 Style Generator
OCR
Web Page to Image
Web Page to PDF
Merge PDF
Split PDF
Latex Equation Editor
Extract Images from PDF
Convert JPEG to PS
Convert Latex to Word
Convert Word to PDF
Image Converter
PDF Converter
Community
Sciweavers
About
Terms of Use
Privacy Policy
Cookies
25
click to vote
DSD
2009
IEEE
84
views
Hardware
»
more
DSD 2009
»
Temperature- and Cost-Aware Design of 3D Multiprocessor Architectures
14 years 6 months ago
Download
vlsicad.ucsd.edu
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
Ayse Kivilcim Coskun, Andrew B. Kahng, Tajana Simu...
claim paper
Read More »