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25
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DSD
2009
IEEE
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DSD 2009
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Temperature- and Cost-Aware Design of 3D Multiprocessor Architectures
14 years 7 months ago
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vlsicad.ucsd.edu
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
Ayse Kivilcim Coskun, Andrew B. Kahng, Tajana Simu...
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