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DSD
2009
IEEE
84views Hardware» more  DSD 2009»
14 years 7 months ago
Temperature- and Cost-Aware Design of 3D Multiprocessor Architectures
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
Ayse Kivilcim Coskun, Andrew B. Kahng, Tajana Simu...