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38
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GLVLSI
2005
IEEE
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VLSI
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GLVLSI 2005
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Thermal aware cell-based full-chip electromigration reliability analysis
14 years 5 months ago
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www-mtl.mit.edu
A hierarchical scheme with cells and modules is crucial for managing design complexity during a large integrated circuit design. We present a methodology for thermal aware cell-ba...
Syed M. Alam, Donald E. Troxel, Carl V. Thompson
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