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ICCAD
2001
IEEE
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14 years 9 months ago
Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects
This paper presents both compact analytical models and fast SPICE based 3-D electro-thermal simulation methodology to characterize thermal effects due to Joule heating in high per...
TingYen Chiang, Kaustav Banerjee, Krishna Saraswat