DAC
2012
ACM
12 years 1 months ago
2012
ACM
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
DAC
2011
ACM
12 years 10 months ago
2011
ACM
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
ECCV
2002
Springer
15 years 17 days ago
2002
Springer
Recent results on sparse coding and independent component analysis suggest that human vision first represents a visual image by a linear superposition of a relatively small number ...