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    DATE
    2009
    IEEE
    161views Hardware» more  DATE 2009»
    Co-design of signal, power, and thermal distribution networks for 3D ICs
    14 years 5 months ago
    Co-design of signal, power, and thermal distribution networks for 3D ICs
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    — Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
    Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad ...
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