GLVLSI
2008
IEEE
13 years 8 months ago
2008
IEEE
The main contribution of this work is an analytical model for finding the upper bound on the temperature difference among various locations on the die. The proposed model can be u...
ASPDAC
2005
ACM
14 years 1 months ago
2005
ACM
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
DAC
2005
ACM
14 years 8 months ago
2005
ACM
Physical phenomena such as temperature have an increasingly important role in performance and reliability of modern process technologies. This trend will only strengthen with futu...