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    ICCAD
    2009
    IEEE
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    Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
    13 years 10 months ago
    Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
    Download  www.gtcad.gatech.edu
    Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
    Young-Joon Lee, Rohan Goel, Sung Kyu Lim
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