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29
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VLSID
2010
IEEE
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VLSI
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VLSID 2010
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Rethinking Threshold Voltage Assignment in 3D Multicore Designs
13 years 6 months ago
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www.engineering.usu.edu
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
Koushik Chakraborty, Sanghamitra Roy
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