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    ASPDAC
    2007
    ACM
    131views Hardware» more  ASPDAC 2007»
    Fast Flip-Chip Pin-Out Designation Respin by Pin-Block Design and Floorplanning for Package-Board Codesign
    14 years 7 months ago
    Fast Flip-Chip Pin-Out Designation Respin by Pin-Block Design and Floorplanning for Package-Board Codesign
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    Deep submicron effects drive the complication in designing chips, as well as in package designs and communications between package and board. As a result, the iterative interface d...
    Ren-Jie Lee, Ming-Fang Lai, Hung-Ming Chen
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