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ESWA
2007
105views more  ESWA 2007»
14 years 17 days ago
Applying rough sets to prevent customer complaints for IC packaging foundry
Packaging is classified as one of back-end processes in the integrated circuits (ICs) manufacturing, highly capital-intensive and involves complex processes. Unlike the front-end...
Hsu-Hao Yang, Tzu-Chiang Liu, Yen-Ting Lin
CORR
2007
Springer
74views Education» more  CORR 2007»
14 years 17 days ago
Packaging of RF Mems Switching Functions on Alumina Substrate
The expending development of wireless communication requires strong demands for components with improved capabilities. RF MEMS devices offer a variable alternative to conventional...
M.-K. El Khatib, Arnaud Pothier, Pierre Blondy