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    ICCAD
    2009
    IEEE
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    Pad assignment for die-stacking System-in-Package design
    13 years 9 months ago
    Pad assignment for die-stacking System-in-Package design
    Download  home.eng.iastate.edu
    Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
    Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
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