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27
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ICCAD
2006
IEEE
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ICCAD 2006
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Yield prediction for 3D capacitive interconnections
14 years 8 months ago
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www.cecs.uci.edu
Capacitive interconnections are very promising structures for high-speed and low-power signaling in 3D packages. Since the performance of AC links, in terms of Band-Width and Bit-...
Alberto Fazzi, L. Magagni, Mario de Dominicis, Pao...
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