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ICCAD
2006
IEEE
137views Hardware» more  ICCAD 2006»
14 years 8 months ago
Yield prediction for 3D capacitive interconnections
Capacitive interconnections are very promising structures for high-speed and low-power signaling in 3D packages. Since the performance of AC links, in terms of Band-Width and Bit-...
Alberto Fazzi, L. Magagni, Mario de Dominicis, Pao...