With the shift to many-core chip multiprocessors (CMPs), a critical issue is how to effectively coordinate and manage the execution of applications and hardware resources to overc...
Wei Wang, Tanima Dey, Ryan W. Moore, Mahmut Aktaso...
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...