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39
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DATE
2009
IEEE
161
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DATE 2009
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Co-design of signal, power, and thermal distribution networks for 3D ICs
14 years 5 months ago
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— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad ...
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