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26
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DAC
2008
ACM
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Computer Architecture
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DAC 2008
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Keeping hot chips cool: are IC thermal problems hot air?
14 years 2 months ago
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www.ece.ncsu.edu
level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart pro...
Ruchir Puri, Devadas Varma, Darvin Edwards, Alan J...
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