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ISCA
2003
IEEE
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ISCA 2003
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Temperature-Aware Microarchitecture
14 years 4 months ago
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www.cs.virginia.edu
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakuma...
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