Sciweavers
Explore
Publications
Books
Software
Tutorials
Presentations
Lectures Notes
Datasets
Labs
Conferences
Community
Upcoming
Conferences
Top Ranked Papers
Most Viewed Conferences
Conferences by Acronym
Conferences by Subject
Conferences by Year
Tools
Sci2ools
International Keyboard
Graphical Social Symbols
CSS3 Style Generator
OCR
Web Page to Image
Web Page to PDF
Merge PDF
Split PDF
Latex Equation Editor
Extract Images from PDF
Convert JPEG to PS
Convert Latex to Word
Convert Word to PDF
Image Converter
PDF Converter
Community
Sciweavers
About
Terms of Use
Privacy Policy
Cookies
29
click to vote
ICCD
2007
IEEE
225
views
Hardware
»
more
ICCD 2007
»
Fine grain 3D integration for microarchitecture design through cube packing exploration
14 years 5 months ago
Download
www.cs.ucla.edu
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
claim paper
Read More »