147
Voted
GLVLSI
2009
IEEE
14 years 12 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
128
Voted
VLSI
2010
Springer
15 years 17 days ago
2010
Springer
—This paper proposes a novel technique to exploit the high bandwidth offered by through silicon vias (TSVs). In the proposed approach, synchronous parallel 3D links are replaced ...