spatially-correlated intra-die variations

ICCAD
2009
IEEE

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Virtual probe: A statistically optimal framework for minimum-cost silicon characterization of nanoscale integrated circuits

13 years 9 months ago

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In this paper, we propose a new technique, referred to as virtual probe (VP), to efficiently measure, characterize and monitor both inter-die and spatially-correlated intra-die va...

Xin Li, Rob A. Rutenbar, R. D. (Shawn) Blanton

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