DAC
2012
ACM
12 years 1 months ago
2012
ACM
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
DAC
2011
ACM
12 years 10 months ago
2011
ACM
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...