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—Escalating system-on-chip design complexity is the design community to raise the level of abstraction beyond register transfer level. Despite the unsuccessful adoptions of early...
Jason Cong, Bin Liu, Stephen Neuendorffer, Juanjo ...
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
—This paper presents a hybrid automatic test pattern generation (ATPG) technique using the staggered launch-oncapture (LOC) scheme followed by the one-hot LOC scheme for testing ...
Abstract—This work introduces GRIP, a global routing technique via integer programming. GRIP optimizes wirelength and via cost directly without going through a traditional layer ...
Tai-Hsuan Wu, Azadeh Davoodi, Jeffrey T. Linderoth