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3DIC
2009
IEEE
178views Hardware» more  3DIC 2009»
13 years 10 months ago
Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs
This paper presents an analysis and comparison between synchronous and delay-insensitive asynchronous logic circuits on thermal distributions for investigating novel solutions to t...
Brent Hollosi, Tao Zhang, Ravi Sankar Parameswaran...