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33
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HPCA
2007
IEEE
140
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Distributed And Parallel Com...
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HPCA 2007
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Thermal Herding: Microarchitecture Techniques for Controlling Hotspots in High-Performance 3D-Integrated Processors
14 years 12 months ago
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www.bioperf.org
3D integration technology greatly increases transistor density while providing faster on-chip communication. 3D implementations of processors can simultaneously provide both laten...
Kiran Puttaswamy, Gabriel H. Loh
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