FPGA logic densities continue to increase at a tremendous rate. This has had the undesired consequence of increased power density, which manifests itself as higher ondie temperatu...
Sivakumar Velusamy, Wei Huang, John Lach, Mircea R...
Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature managem...
Anahita Shayesteh, Eren Kursun, Timothy Sherwood, ...