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    2007
    IEEE
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    Three-dimensional multiprocessor system-on-chip thermal optimization
    14 years 5 months ago
    Three-dimensional multiprocessor system-on-chip thermal optimization
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    3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
    Chong Sun, Li Shang, Robert P. Dick
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