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    ISLPED
    2006
    ACM
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    Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power
    14 years 1 months ago
    Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power
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    All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
    Hao Yu, Yiyu Shi, Lei He, Tanay Karnik
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